Electrolube HTSP – silikoninen lämpötahna Plus, 50 ml

Electrolube HTSP – Silicone Heat Transfer Compound Plus is a high-performance silicone thermal paste for demanding heat-transfer applications.

The non-curing material offers thermal conductivity of approximately 3.0 W/m·K, good non-creep properties and a wide operating-temperature range.

Key features

• Thermal conductivity approximately 3.0 W/m·K
• Non-curing silicone formulation
• Wide operating-temperature range

Typical applications

• Power electronics
• Processors and semiconductors
• Heat sinks and LED modules

Package: 50 ml

Follow the product technical data sheet and safety data sheet. Verify material compatibility and process suitability before production use.